Description
Product Overview
Bymugo HY910 is a premium thermal conductive adhesive designed for demanding electronic applications. Featuring a thermal conductivity of 0.975 W/m‑K, it efficiently transfers heat away from sensitive components such as MOSFETs, LEDs, ICs, and GPU chipsets. The formula is non‑electrical, odorless, moisture‑resistant, and non‑toxic, ensuring safety for both users and devices. Packaged in a compact 8.15 × 4.92 × 0.71 in. tube weighing 1.13 oz, the adhesive cures in roughly 30 minutes at 25 °C, delivering a strong bond with a tensile strength of 2.1 MPa. Its service temperature spans from –60 °C to 250 °C, making it suitable for a broad range of industrial and consumer electronics.
Usage
The HY910 adhesive excels in environments where reliable heat dissipation is critical. It is ideal for assembling power modules, LED lighting arrays, high‑performance computing boards, and automotive electronics. Installers can apply a thin layer directly onto component surfaces, press the parts together, and allow the adhesive to cure. Its quick‑drying nature minimizes downtime, which is valuable in production lines and field repairs. 
Why Choose Us
Bymugo combines rigorous material science with strict quality controls to deliver an adhesive that meets industrial standards. The HY910 formulation is tested for consistent thermal performance, non‑conductivity, and long‑term stability under temperature cycling. Customers benefit from a product that reduces thermal resistance, prevents overheating, and extends the lifespan of electronic assemblies. Our commitment to safety means the adhesive is free from hazardous solvents, making it suitable for clean‑room environments.
Key Features
- High thermal conductivity of 0.975 W/m‑K for efficient heat transfer
- Non‑electrical and non‑toxic, safe for components and users
- Strong adhesion to metals and non‑metals with 2.1 MPa tensile strength
- Fast curing in ~30 minutes at room temperature
- Wide operating temperature range from –60 °C to 250 °C
FAQ
Is the adhesive electrically conductive?
No, HY910 is specifically formulated to be non‑electrical conductive, preventing short circuits while still providing excellent thermal performance.
How long does it take to cure?
The adhesive reaches full strength in approximately 30 minutes at 25 °C, though full thermal conductivity is achieved after 24 hours.
Can it be used on plastic components?
Yes, HY910 bonds well to most plastics as well as metals, making it versatile for mixed‑material assemblies.
What is the recommended thickness for optimal thermal transfer?
A thin, uniform layer of 0.1 mm to 0.3 mm is recommended to minimize thermal resistance while ensuring adequate coverage.
Is the adhesive resistant to moisture and temperature cycling?
Yes, the formulation is moisture‑resistant and maintains performance through repeated heating and cooling cycles within its service temperature range.
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