Polymer Composites Epoxy Resin Electronic Potting Compound

Description

Product Overview

Polymer Composites MAXMCR192OZ is a high-performance, opaque black epoxy resin formulated for electronic potting and encapsulating applications. This non-electrically conductive compound insulates AC/DC high and low voltage components, ensuring reliable protection for printed circuit boards. It features a 2:1 mix ratio and medium setting time, curing rigidly at room temperature to withstand operating temperatures up to 190°F (90°C). The product bonds securely to ABS, PVC plastic housing, wire jackets, mold-injected components, powder-coated surfaces, and metal substrates, making it versatile for various industrial needs. With dimensions of 14 x 12 x 12 inches and a weight of 15 pounds, it offers substantial coverage for embedding and waterproofing electronic assemblies.

Usage

This epoxy resin is ideal for environments requiring durable insulation and moisture resistance, such as automotive electronics, industrial control systems, and consumer device manufacturing. It suits occasions where permanent masking and embedding of components are necessary to prevent electrical shorts and environmental damage. The target audience includes electronics engineers, manufacturers, and technicians in industrial and scientific sectors who need a reliable, room-temperature-curing solution for protecting sensitive circuits and housings from harsh conditions.

Why Choose Us

Polymer Composites delivers superior quality with this epoxy resin, emphasizing its non-conductive properties that prevent electrical interference and enhance safety. The product’s ability to bond to diverse materials without conductivity issues sets it apart from alternatives, ensuring long-term reliability in demanding applications. Backed by a 4.4-star customer rating and proven performance in electrically conductive adhesives rankings, it offers trusted assurance for professionals seeking effective, easy-to-use potting compounds.

Key Features

• Non-electrically conductive epoxy resin for safe insulation of electronic components
• Bonds effectively to ABS, PVC, metals, and coated substrates for versatile applications
• Room temperature curing with a rigid finish that resists up to 190°F operating temperatures
• Opaque black color provides permanent masking and aesthetic consistency
• Medium setting time and 2:1 mix ratio ensure manageable application and reliable results

FAQ

What is the primary use of this epoxy resin?

It is designed for electronic potting and encapsulating to insulate and waterproof printed circuit boards and components, preventing electrical issues and environmental damage.

How long does it take to cure?

The epoxy cures at room temperature with a medium setting time, typically becoming rigid within hours depending on environmental conditions, for efficient project completion.

Can it be used on metal surfaces?

Yes, it bonds well to metal substrates, as well as plastics like ABS and PVC, making it suitable for a wide range of industrial and electronic applications.

Is this product electrically conductive?

No, it is non-electrically conductive, ensuring it does not interfere with circuit operations and provides safe insulation for high and low voltage systems.

What is the mix ratio for application?

The mix ratio is 2:1, which is straightforward to measure and blend for consistent results in potting and embedding tasks.